ARCS 產業專用檢測機

半導體產業

Wafer 晶圓檢測系統
Wafer Inspection System

Die 晶粒檢測系統
Die Saw Inspection

  • wafer dimensions

  • afer defect

  • Die dimensions

  • Die saw

  • Die chip edges

  • Die FM

  • Die Ink / Test

Leadframe 導線架檢測系統
Leadframe Inspection

Die Bonding 黏晶檢測系統
Die Bonding Inspection
Die Inspection Items

  • Leadframe dimensions

  • Leadframe placement offset

  • Leadframe defect

  • Die missing

  • Die placement - offset

  • Die rotation offset

  • Die defect

  • Die wrong

Wire Bonding 銲點檢測系統
Wire Bonding Inspection
Wire Ball Inspecting Items

Wire Bonding 檢測系統
Wire Bonding Inspecting Items

  • Ball missing

  • Ball placement

  • Ball size

  • Ball broken

  • Ball defect

  • Wire broken

  • Wire missing

  • Wire unbonded

  • Wire short

  • Wire height

  • Wire close gap

  • Wire height

  • Wire sway

凸塊檢測系統
Bumping Inspection Items

Probe Card 探針卡檢測系統
Probe Card Inspection System
Probe Card PIN Inspecting and Adjustment Items

  • Bump ball missing

  • Bump ball placement

  • Bump ball size

  • Bump ball broken

  • PIN missing

  • PIN broken

  • PIN placement

  • PIN offset

  • PIN size

  • PIN height

  • PIN level

PIS 探針卡檢測及調針系統

PIS Series for Probe Card PIN Inspection and Adjustment

越南巨源集團是台灣ARCS影像測量系統的越南代理,有需要的客戶歡迎參考選購

台灣服務窗口:Ms.Diana, Email: info@arcs-trade.com